Organizing Committee
Applications Technical Program Committee
Networking Technical Program Committee
Phy/MAC Technical Program Committee
Valentine Aalo
Florida Atlantic University USA
Alhussein Abouzeid
Rensselaer Polytechnic Institute USA
Fumiyuki Adachi
Tohoku University Japan
Dharma Agrawal
University of Cincinnati USA
Sonia Aissa
University of Quebec, INRS-EMT, Canada Canada
Ali Almutairi
Kuwait University Kuwait
Emad Alsusa
Manchester University UK
Huseyin Arslan
University of South Florida USA
Nallanathan Arumugam
National University of Singapore Singapore
Georgia Athanasiadou
University of Peloponnese Greece
Fulvio Babich
University of Trieste Italy
Saewoong Bahk
Seoul National University Korea
Steven Blostein
Queen's University Canada
Jianfei Cai
Nanyang Technological University Singapore
Xiaodong Cai
University of Miami USA
Lei Cao
The University of Mississippi USA
Jim Cavers
Simon Fraser University Canada
Periklis Chatzimisios
TEI of Thessaloniki Greece
Biao Chen
Syracuse University USA
Lan Chen
DoCoMo Beijing Communication Laboratories Co., Ltd P.R. China
Sheng Chen
University of Southampton UK
Maggie Cheng
University of Missouri USA
Qi Cheng
Oklahoma State University USA
Yu Cheng
Illinois Institute of Technology USA
Chunxiao
Chigan Michigan Tech USA
Chia-Chin Chong
NTT DoCoMo USA Labs USA
Andrea Conti
IEIIT/CNR Univ. of Bologna, ENDIF Univ. of Ferrara Italy
Justin Coon
Toshiba TRL UK
Carlos Cordeiro
Philips Research USA USA
Lin Dai
University of Delaware USA
Zaher Dawy
American University of Beirut Lebanon
Jing Deng
University of New Orleans USA
Mischa Dohler
France Telecom R&D France
Xiaodai Dong
University of Victoria Canada
Tolga Duman
Arizona State University USA
Binwen Fan
Harbin Institute of Technology P.R. China
Romano Fantacci
University of Florence Italy
Jeffrey Foerster
Intel Research and Development USA
Bernard Fong
Auckland University New Zealand
Minyue Fu
University of Newcastle Australia
David Gesbert
Eurecom Institute France
Ian Glover
University of Strathclyde UK
T. Aaron Gulliver
University of Victoria Canada
Dongning Guo
Northwestern University USA
Zihua Guo
Lenovo P.R. China
Ridha Hamila
Institute of Communication Engineering, Finland
Zhu Han
University of Maryland, College Park USA
Nidhi Hegde
France Telecom R & D France
Geert Heijenk
University of Twente The Netherlands
Are Hjørungnes
Unversity of Oslo Norway
Paul Ho
Simon Fraser University Canada
Liang Hong
Tennessee State University USA
Ekram Hossain
University of Manitoba Canada
Defeng Huang
University of Western Australia Australia
Taewon Hwang
Yonsei University Korea
Hamid Jafarkhani
University of California, Irvine USA
Sarangapani Jagannathan
University of Missouri Rolla USA
Hai Jiang
Princeton University USA
Markku Juntti
University of Oulu Finland
Stefan Kaiser
DoCoMo Euro-Labs Germany
George Karagiannidis
Aristotle University of Thessaloniki Greece
Sang Wu Kim
Iowa State University USA
Witold Krzymien
University of Alberta / TRLabs Canada
Lutz Lampe
University of British Columbia Canada
Vincent Lau
The Hong Kong University of Science and Technology Algeria
Eddie Law
Ryerson University in Toronto Canada
Tho Le-Ngoc
McGill University Canada
Zhongding Lei
Institute for Infocomm Research Singapore
Cyril Leung
University of British Columbia Canada
Victor Leung
The University of British Columbia Canada
Jing Li
Lehigh University USA
Tongtong Li
Michigan State University USA
Ying-Chang Liang
Institute for Infocomm Research Singapore
Wanjiun Liao
National Taiwan University Taiwan
Teng Joon Lim
University of Toronto Canada
Sergey Loyka
University of Ottawa Canada
Angel Lozano
Bell Labs (Lucent Technologies) USA
Marco Luise
University of Pisa Italy
Xiaoli Ma
Georgia Institute of Technology USA
Yao Ma
Iowa State University USA
Amine Maaref
University of Quebec, INRS-EMT, Canada Canada
Bodhaswar Maharaj
University of Pretoria South Africa
Ranjan Mallik
Indian Institute of Technology - Delhi India
Yongyi Mao
University of Ottawa Canada
Mario Marchese
DIST- University of Genoa Italy
Brian Mark
George Mason University USA
Maria Luisa Merani
University of Modena and Reggio Emilia Italy
Scott Miller
Texas A&M University USA
Hlaing Minn
University of Texas at Dallas USA
Jelena Misic
University of Manitoba Canada
Hidekazu Murata
Kyoto University Japan
Ross Murch
HKUST Hong Kong
Shinichi Nomoto
KDDI R&D Laboratories Inc. Japan
Hideki Ochiai
Yokohama National University Japan
Claude Oestges
Université catholique de Louvain Belgium
Jan Olivier
University of Pretoria South Africa
Sangheon Pack
University of Waterloo Canada
Zhengang Pan
University of Hong Kong Hong Kong
Chirag Patel
Qualcomm USA
Dongyu Qiu
Concordia University Canada
Robert Qiu
Tennessee Tech University USA
Mark Reed
National ICT Australia, ANU Australia
Sebastien Roy
Laval University Canada
Humphrey Rutagemwa
University of Waterloo Canada
Anna Scaglione
Cornell University USA
Robert Schober
University of British Columbia Canada
Erchin Serpedin
Texas A&M University USA
Christian Sgraja
Qualcomm Germany
Minghui Shi
University of Waterloo Canada
Claudio Silva
Virginia Tech USA
S. Ben Slimane
Royal Institute of Technology, Stockholm Sweden
Daniel K. C.
So University of Manchester UK
Kevin Sowerby
The University of Auckland New Zealand
Umberto Spagnolini
Politecnico di Milano Italy
Andrej Stefanov
Polytechnic University USA
Meixia Tao
National University of Singapore Singapore
Vahid Tarokh
Harvard University USA
Chintha Tellambura
University of Alberta Canada
Velio Tralli
University of Ferrara - Italy Italy
Murat Uysal
University of Waterloo Canada
Shahrokh Valaee
University of Toronto Canada
Matthew Valenti
West Virginia University USA
Konstantinos Voudouris
Technological Educational Institute of Athens Greece
Cheng-Xiang Wang
Heriot-Watt University UK
Li-Chun Wang
National Chiao Tung University Taiwan
Wenye Wang
NC State University USA
Zhengdao Wang
Iowa State University USA
Shuangqing Wei
Louisiana State University USA
Moe Win
Massachusetts Institute of Technology USA
Kai Kit Wong
University College London UK
Kainam Thomas Wong
Hong Kong Polytechnic University Hong Kong
Jingxian Wu
Sonoma State University USA
Tao Wu
Nokia USA
Alexander Wyglinski
The University of Kansas USA
Ariton Xhafa
Texas Instruments Inc. USA
Xiang-Gen Xia
University of Delaware USA
Chengshan Xiao
University of Missouri-Columbia USA
Linda Jiang Xie
University of North Carolina at Charlotte USA
Chenyang Yang
Beihang University P.R. China
Hong-Chuan Yang
University of Victoria Canada
Lie-Liang Yang
University of Southampton UK
Liuqing Yang
University of Florida USA
Oliver Yang
University of Ottawa Canada
Halim Yanikomeroglu
Carleton University Canada
Yu-Dong Yao
Stevens Institute of Technology USA
Aylin Yener
Pennsylvania State University USA
Susumu Yoshida
Graduate School of Informatics, Kyoto University Japan
Guosen Yue
NEC Laboratories America, Inc. USA
Alberto Zanella
CSITE-CNR, DEIS, University of Bologna Italy
Maciej Zawodniok
University of Missouri-Rolla USA
Yonghong Zeng
Institute for Infocomm Research Singapore
Jinyun Zhang
MERL USA
Junshan Zhang
Arizona State University USA
Keith Q. T. Zhang
City University of Hong Kong Hong Kong
Xi Zhang
Texas A&M University, ECE Department USA
Yingjun Zhang
The Chinese University of Hong Kong Hong Kong
Lian Zhao
Ryerson University Canada
Xinsheng Zhao
Southeast University P.R. China
Fuchun Zheng
Victoria University Australia
Yahong Zheng
University of Missouri - Rolla USA
Shengli Zhou
University of Connecticut USA
Weihua Zhuang
University of Waterloo Canada
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